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1. general description 74hc238 and 74hct238 are high-speed si-gate cmos devices and are pin compatible with low-power schottky ttl (lsttl). the 74hc238/74hct238 decoders accept three binary weighted address inputs (a0, a1, a2) and when enabled, provide 8 mutually exclusive active high outputs (y0 to y7). the 74hc238/74hct238 features three enable inputs: two active low ( e1 and e2) and one active high (e3). every output will be low unless e1 and e2 are low and e3 is high. this multiple enable function allows easy parallel expansion of the 238 to a 1-to-32 (5 lines to 32 lines) decoder with just four 238 ics and one inverter. the 238 can be used as an eight output demultiplexer by using one of the active low enable inputs as the data input and the remaining enable inputs as strobes. unused enable inputs must be permanently tied to their appropriate active high or low state. the 74hc238/74hct238 is similar to the 74hc138/74hct138 but has non-inverting outputs. 2. features n demultiplexing capability n multiple input enable for easy expansion n ideal for memory chip select decoding n active high mutually exclusive outputs n multiple package options n complies with jedec standard no. 7a n esd protection: u hbm jesd22-a114e exceeds 2000 v u mm jesd22-a115-a exceeds 200 v n speci?ed from - 40 cto+85 c and from - 40 c to +125 c 74hc238; 74hct238 3-to-8 line decoder/demultiplexer rev. 03 16 july 2007 product data sheet
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 2 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer 3. ordering information 4. functional diagram table 1. ordering information type number package temperature range name description version 74hc238n - 40 c to +125 c dip16 plastic dual in-line package; 16 leads (300 mil) sot38-4 74hc238d - 40 c to +125 c so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1 74hc238db - 40 c to +125 c ssop16 plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 74hc238pw - 40 c to +125 c tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 74hc238bq - 40 c to +125 c dhvqfn16 plastic dual in-line compatible thermal enhanced very thin quad ?at package; no leads; 16 terminals; body 2.5 3.5 0.85 mm sot763-1 74hct238n - 40 c to +125 c dip16 plastic dual in-line package; 16 leads (300 mil) sot38-4 74hct238d - 40 c to +125 c so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1 74hct238db - 40 c to +125 c ssop16 plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 74hct238pw - 40 c to +125 c tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 74HCT238BQ - 40 c to +125 c dhvqfn16 plastic dual in-line compatible thermal enhanced very thin quad ?at package; no leads; 16 terminals; body 2.5 3.5 0.85 mm sot763-1 fig 1. logic symbol fig 2. functional diagram 001aag752 3 to 8 decoder enable exiting a0 1 a1 2 a2 3 e1 4 e2 5 e3 6 y0 15 y1 14 y2 13 y3 12 y4 11 y5 10 y6 9 y7 7 001aag753 3 to 8 decoder enable exiting a0 1 a1 2 a2 3 e1 4 e2 5 e3 6 y0 15 y1 14 y2 13 y3 12 y4 11 y5 10 y6 9 y7 7
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 3 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer 5. pinning information 5.1 pinning fig 3. logic diagram 001aag754 e1 e2 e3 a0 a1 a2 y0 y1 y2 y3 y4 y5 y6 y7 (1) the die substrate is attached to this pad using conductive die attach material. it can not be used as supply pin or input fig 4. pin con?guration dip16, so16, (t)ssop16 fig 5. pin con?guration dhvqfn16 74hc238 74hct238 a0 v cc a1 y0 a2 y1 e1 y2 e2 y3 e3 y4 y7 y5 gnd y6 001aag755 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 001aag756 74hc238 74hct238 y7 y5 e3 y4 e2 y3 e1 y2 a2 y1 a1 y0 gnd gnd (1) y6 a0 v cc transparent top view 7 10 6 11 5 12 4 13 3 14 2 15 8 9 1 16 terminal 1 index area
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 4 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer 5.2 pin description 6. functional description [1] h = high voltage level; l = low voltage level; x = dont care. table 2. pin description symbol pin description a[0:2] 1, 2, 3 address input e1 4 enable input (active low) e2 5 enable input (active low) e3 6 enable input (active high) y[0:7] 15, 14, 13, 12, 11, 10, 9, 7 output (active high) gnd 8 ground (0 v) v cc 16 supply voltage table 3. function table [1] inputs outputs e1 e2 e3 a0 a1 a2 y0 y1 y2 y3 y4 y5 y6 y7 hxxxxxllllllll xhxxxxllllllll xxlxxxllllllll llhlllhlllllll llhhlllhllllll llhlhlllhlllll llhhhllllhllll llhllhllllhlll llhhlhlllllhll llhlhhllllllhl llhhhhlllllllh
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 5 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer 7. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] for dip16 packages: above 70 c the value of p tot derates linearly at 12 mw/k. [3] for so16 packages: above 70 c the value of p tot derates linearly at 8 mw/k. for ssop16 and tssop16 packages: above 60 c the value of p tot derates linearly at 5.5 mw/k. for dhvqfn16 packages: above 60 c the value of p tot derates linearly at 4.5 mw/k. 8. recommended operating conditions table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +7 v i ik input clamping current v i < - 0.5 v or v i >v cc + 0.5 v [1] - 20 ma i ok output clamping current v o < - 0.5 v or v o >v cc + 0.5 v [1] - 20 ma i o output current - 0.5 v < v o < v cc + 0.5 v - 25 ma i cc supply current - 50 ma i gnd ground current - 50 - ma t stg storage temperature - 65 +150 c p tot total power dissipation dip16 package [2] - 750 mw so16, ssop16, tssop16 and dhvqfn16 packages [3] - 500 mw table 5. recommended operating conditions voltages are referenced to gnd (ground = 0 v). symbol parameter conditions 74hc238 74hct238 unit min typ max min typ max v cc supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 v v i input voltage 0 - v cc 0-v cc v v o output voltage 0 - v cc 0-v cc v t amb ambient temperature - 40 - +125 - 40 - +125 c d t/ d v input transition rise and fall rate v cc = 2.0 v - - 625 - - - ns/v v cc = 4.5 v - 1.67 139 - 1.67 139 ns/v v cc = 6.0 v - - 83 - - - ns/v
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 6 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer 9. static characteristics table 6. static characteristics at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions 25 c - 40 c to +85 c - 40 c to +125 c unit min typ max min max min max 74hc238 v ih high-level input voltage v cc = 2.0 v 1.5 1.2 - 1.5 - 1.5 - v v cc = 4.5 v 3.15 2.4 - 3.15 - 3.15 - v v cc = 6.0 v 4.2 3.2 - 4.2 - 4.2 - v v il low-level input voltage v cc = 2.0 v - 0.8 0.5 - 0.5 - 0.5 v v cc = 4.5 v - 2.1 1.35 - 1.35 - 1.35 v v cc = 6.0 v - 2.8 1.8 - 1.8 - 1.8 v v oh high-level output voltage v i =v ih or v il i o = - 20 m a; v cc = 2.0 v 1.9 2.0 - 1.9 - 1.9 - v i o = - 20 m a; v cc = 4.5 v 4.4 4.5 - 4.4 - 4.4 - v i o = - 20 m a; v cc = 6.0 v 5.9 6.0 - 5.9 - 5.9 - v i o = - 4.0 ma; v cc = 4.5 v 3.98 4.32 - 3.84 - 3.7 - v i o = - 5.2 ma; v cc = 6.0 v 5.48 5.81 - 5.34 - 5.2 - v v ol low-level output voltage v i =v ih or v il i o =20 m a; v cc = 2.0 v - 0 0.1 - 0.1 - 0.1 v i o =20 m a; v cc = 4.5 v - 0 0.1 - 0.1 - 0.1 v i o =20 m a; v cc = 6.0 v - 0 0.1 - 0.1 - 0.1 v i o = 4.0 ma; v cc = 4.5 v - 0.15 0.26 - 0.33 - 0.4 v i o = 5.2 ma; v cc = 6.0 v - 0.16 0.26 - 0.33 - 0.4 v i i input leakage current v i =v cc or gnd; v cc = 6.0 v -- 0.1 - 1.0 - 1.0 m a i cc supply current v i =v cc or gnd; i o =0a; v cc = 6.0 v - - 8.0 - 80 - 160 m a c i input capacitance - 3.5 - - - - - pf 74hct238 v ih high-level input voltage v cc = 4.5 v to 5.5 v 2.0 1.6 - 2.0 - 2.0 - v v il low-level input voltage v cc = 4.5 v to 5.5 v - 1.2 0.8 - 0.8 - 0.8 v v oh high-level output voltage v i =v ih or v il ; v cc = 4.5 v i o = - 20 m a 4.4 4.5 - 4.4 - 4.4 - v i o = - 4.0 ma 3.98 4.32 - 3.84 - 3.7 - v v ol low-level output voltage v i =v ih or v il ; v cc = 4.5 v i o =20 m a - 0 0.1 - 0.1 - 0.1 v i o = 4.0 ma - 0.16 0.26 - 0.33 - 0.4 v i i input leakage current v i =v cc or gnd; v cc = 5.5 v -- 0.1 - 1.0 - 1.0 m a
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 7 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer 10. dynamic characteristics i cc supply current v i =v cc or gnd; v cc = 5.5 v; i o =0a - - 8.0 - 80 - 160 m a d i cc additional supply current per input pin; v i =v cc - 2.1 v; other inputs at v cc or gnd; v cc = 4.5 v to 5.5 v; i o =0a an inputs - 70 252 - 315 - 343 m a e1, e2 inputs - 40 144 - 180 - 196 m a e3 input - 145 522 - 653 - 711 m a c i input capacitance - 3.5 - - - - - pf table 6. static characteristics continued at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions 25 c - 40 c to +85 c - 40 c to +125 c unit min typ max min max min max table 7. dynamic characteristics gnd = 0 v; test circuit see figure 8 . symbol parameter conditions 25 c - 40 c to +125 c min typ max max (85 c) max (125 c) unit 74hc238 t pd propagation delay an to yn; see figure 6 [1] v cc = 2.0 v - 47 150 190 225 ns v cc = 4.5 v - 17 30 38 45 ns v cc = 5.0 v; c l =15pf - 14 - - - ns v cc = 6.0 v - 14 26 33 38 ns e3 to yn; see figure 6 [1] v cc = 2.0 v - 52 160 200 240 ns v cc = 4.5 v - 19 32 40 48 ns v cc = 5.0 v; c l =15pf - 16 - - - ns v cc = 6.0 v - 15 27 34 41 ns en to yn or see figure 7 [1] v cc = 2.0 v - 50 155 195 235 ns v cc = 4.5 v - 18 31 39 47 ns v cc = 5.0 v; c l =15pf - 17 - - - ns v cc = 6.0 v - 14 26 33 40 ns t t transition time see figure 6 and figure 7 [2] v cc = 2.0 v - 19 75 95 110 ns v cc = 4.5 v - 7 15 19 22 ns v cc = 6.0 v - 6 13 16 19 ns c pd power dissipation capacitance per package; v i = gnd to v cc [3] -72- - -pf
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 8 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer [1] t pd is the same as t phl and t plh . [2] t t is the same as t thl and t tlh . [3] c pd is used to determine the dynamic power dissipation (p d in m w): p d =c pd v cc 2 f i n+ ? (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; ? (c l v cc 2 f o ) = sum of outputs. 11. waveforms 74hct238 t pd propagation delay an to yn; see figure 6 [1] v cc = 4.5 v - 19 35 44 53 ns v cc = 5.0 v; c l =15pf - 18 - - - ns e3 to yn; see figure 6 [1] v cc = 4.5 v - 20 37 46 56 ns v cc = 5.0 v; c l =15pf - 20 - - - ns en to yn or see figure 7 [1] v cc = 4.5 v - 20 35 44 53 ns v cc = 5.0 v; c l =15pf - 21 - - - ns t t transition time v cc = 4.5 v; see figure 6 and figure 7 [2] - 7 15 19 22 ns c pd power dissipation capacitance per package; v i = gnd to v cc - 1.5 v [3] -76- - -pf table 7. dynamic characteristics gnd = 0 v; test circuit see figure 8 . symbol parameter conditions 25 c - 40 c to +125 c min typ max max (85 c) max (125 c) unit measurement points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 6. input (an, e3) to output (yn) propagation delays and output transition times 001aag757 an, e3 input yn output t thl t tlh v m v m v x v y t phl t plh
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 9 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer measurement points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 7. input ( e1, e2) to output (yn) propagation delays and output transition times 001aag758 e1, e2 input yn output t thl t tlh v m v m v x v y t phl t plh table 8. measurement points type input output v m v m v x v y 74hc238 0.5v cc 0.5v cc 0.1v cc 0.9v cc 74hct238 1.3 v 1.3 v 0.1v cc 0.9v cc
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 10 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer test data is given in t ab le 9 . de?nitions for test circuit: r t = termination resistance should be equal to output impedance z o of the pulse generator. c l = load capacitance including jig and probe capacitance. r l = load resistance. s1 = test selection switch fig 8. load circuit for measuring switching times v m v m t w t w 10 % 90 % 0 v v i v i negative pulse positive pulse 0 v v m v m 90 % 10 % t f t r t r t f 001aad983 dut v cc v cc v i v o r t r l s1 c l open pulse generator table 9. test data type input load s1 position v i t r , t f c l r l t phl , t plh 74hc238 v cc 6 ns 15 pf, 50 pf 1 k w open 74hct238 3 v 6 ns 15 pf, 50 pf 1 k w open
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 11 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer 12. package outline fig 9. package outline sot38-4 (dip16) references outline version european projection issue date iec jedec jeita sot38-4 95-01-14 03-02-13 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 16 1 9 8 e pin 1 index b 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.03 0.17 0.02 0.13 dip16: plastic dual in-line package; 16 leads (300 mil) sot38-4
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 12 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer fig 10. package outline sot109-1 (so16) x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 13 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer fig 11. package outline sot338-1 (ssop16) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 7.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 8 0 o o 0.13 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot338-1 99-12-27 03-02-19 (1) w m b p d h e e z e c v m a x a y 1 8 16 9 q a a 1 a 2 l p q detail x l (a ) 3 mo-150 pin 1 index 0 2.5 5 mm scale ssop16: plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 a max. 2
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 14 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer fig 12. package outline sot403-1 (tssop16) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot403-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 18 16 9 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 a max. 1.1 pin 1 index
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 15 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer fig 13. package outline sot763-1 (dhvqfn16) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 3.6 3.4 d h 2.15 1.85 y 1 2.6 2.4 1.15 0.85 e 1 2.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot763-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot763-1 dhvqfn16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 27 15 10 9 8 1 16 x d e c b a terminal 1 index area a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) 02-10-17 03-01-27
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 16 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer 13. abbreviations 14. revision history table 10. abbreviations acronym description cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 11. revision history document id release date data sheet status change notice supersedes 74hc_hct238_3 20070716 product data sheet - 74hc_hct238_cnv_2 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? added type number 74hc238bq and 74HCT238BQ (dhvqfn16 package) 74hc_hct238_cnv_2 19970828 product speci?cation - -
74hc_hct238_3 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 03 16 july 2007 17 of 18 nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 15.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 15.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 16. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74hc238; 74hct238 3-to-8 line decoder/demultiplexer ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 16 july 2007 document identifier: 74hc_hct238_3 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 functional description . . . . . . . . . . . . . . . . . . . 4 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 recommended operating conditions. . . . . . . . 5 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 6 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 15.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 16 contact information. . . . . . . . . . . . . . . . . . . . . 17 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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